Lucas Beran joined Dell’Oro Group in 2021 and is responsible for coverage of Data Center Physical Infrastructure markets.
Prior to joining Dell’Oro Group, Mr. Beran spent five years as an analyst at Informa and IHS Markit covering data center infrastructure markets, including UPS, single-phase and three-phase power distribution, precision cooling, modular data center deployments and IT racks and enclosures. During his time, Mr. Beran advised clients on market size and forecasts, vendor landscapes, product development, marketing initiatives and consulted on prospective acquisitions. Mr. Beran also has two years of IT Operations experience from the Danish Institute of Study Abroad (DIS) in Copenhagen, Denmark, where he maintained the universities’ server rooms and network closets.
Mr. Beran’s research and analysis has been frequently quoted in leading trade and business publications including Bloomberg, CRN, Data Center Knowledge, Information Week, Mission Critical, SdxCentral, The NexPlatform, The Register, and The Verge. Mr. Beran regularly speaks at industry conferences such as Data Center Dynamics and Data Center World, and also presents to senior executives at corporations. Mr. Beran graduated cum laude with a B.A. in Economics and Applied Mathematics minor from the Honors College of Boise State University.
Press Releases
- AI Design Shifts Slow Data Center Physical Infrastructure Market in 1Q 2024, According to Dell’Oro Group
- Dell’Oro Group Launches New Data Center Liquid Cooling Advanced Research Report
- Record Year for Data Center Physical Infrastructure Market with 16 Percent Growth for 2023, According to Dell’Oro Group
Articles
Blogs
- Exploring the Data Center Physical Infrastructure (DCPI) Market Landscape in 2024
- AI is Ushering in a New Era for Data Center Physical Infrastructure
- What We Can Learn from the COOLERCHIPS Project Awards
Videos
- What’s next for data center physical infrastructure in 2023?
- Achieving Sustainable Data Center Growth
- OCP Global Summit 2022–Keeping Cool – Leading Colo Leverages Efficient Rack Cooling Doors for High-Density Compute
Webinars
- OCP Webinar: Direct-to-Chip Liquid Cooling for the AI Data Center
- OCP Webinar: Liquid Cooling TCO Comparison for the AI Data Center
- DCD Connect: The path to reliable, emission free backup
In the News
- Vertiv adds Direct Expansion Cooling Unit
- Exclusive: AWS to follow Nvidia into high-power AI silicon with Trainium3 chip
- Could GPU power levels break the data center ecosystem?