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The Huawei Connect 2018 was held in Shanghai on October 10 to 12 and over 20,000 attendees from different countries were at this event. It was a fascinating week led by Huawei key leaders sharing their Artificial Intelligence (AI) strategy along with its vision of an AI powered intelligent world.  For this event, I was looking forward to seeing how Huawei is transforming itself from primarily a provider of IT hardware solutions, to a provider of full-stack cloud services and applications.

Given that my interest lies in the areas of compute, server network connectivity, and cloud data center infrastructure, here are my main takeaways from the event:

AI Chips: Huawei launched the Ascend 910 and Ascend 310 at Huawei Connect 2018, aimed at accelerating AI workloads. The Ascend 910 is designed for the core data center, whereas the Ascend 310 is suitable for low-power edge computing. Both chips are designed by Hisilicon, a company owned by Huawei.  The Ascend announcement is groundbreaking because this is a rare instance in which a manufacturer is able to launch a viable alternative to accelerated processors, such as the GPU from NVidia, or FPGA from Intel or Xilinx, for AI workloads. Google, through its huge engineering resources, have also deployed its own accelerated processor, called the TPU, in its data centers. However, Huawei claims that a cluster of Ascend 910 can even outperform a comparable pod of TPU3, by a factor of 2.5X in floating point operations. More importantly, this is the first time in which a Chinese manufacturer has developed a seemingly competitive accelerated processor, and is aligned with China’s long-term goal of becoming self-reliant in the IT hardware market.  I believe the inclusion of another silicon vendor for accelerated chip sets, especially a foreign one, will drive additional innovation and adoption for AI technologies.

Smart NIC: Huawei announced a Smart NIC with an ASIC, also powered by Hisilicon, for applications such as offloading TCP/IP from the CPU. Initially this Smart NIC will likely be deployed in Huawei’s own cloud servers, but could eventually be sold alongside Huawei’s compute and storage portfolio to Huawei’s enterprise customers.  The Smart NIC market started to heat up in 2018 with no fewer than six major network adapter vendors, such as Intel, Broadcom, Mellanox, announcing or qualifying new products.  Smart NIC deployment is currently still fragmented and limited only to several hyperscalers.  I question whether or not the benefits Smart NICs could outweigh its high price premium and power consumption, which are factors inhibiting more wide-spread deployment of Smart NICs in the data center. However, Huawei’s vertical integration efforts might justify the economics of deploying Smart NIC in its cloud data centers.

Cloud Infrastructure: Huawei has been ramping and advancing its infrastructure to better compete against other public cloud providers, such as Alibaba Cloud. Currently, Huawei operates data centers worldwide, and is in the process of developing state-of-art modular data centers with redundant availability zones, and to optimize utilization and improve efficiencies.  In terms of absolute scale, Huawei has a long ways to go before catching up to other hyperscalers in terms of capacity.  However, I believe that Huawei is in a strong position to grow its public cloud business given the company’s penetration in enterprise accounts, and the only vendor to have an integrated cloud platform, from accelerated processors, to a global network of cloud data centers.

While the adoption of AI technologies is still nascent, its growth has been explosive with numerous potential applications that could change our daily lives.  Smart NIC is another area in which I am closely tracking.  It remains to be seen whether or not Huawei’s internal development of its Smart NIC will pay off and drive a strong use case.  For the next Huawei Connect event, I am looking forward to advances in the development and deployment of Huawei’s own silicon solutions in the fabric of Huawei’s future generation of data centers.

To learn more about my current market research coverage:

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I attended the MEF18 conference this week in Los Angeles and had the opportunity to meet and interact with key industry stakeholders and experts.  I was also a judge for the 2018 MEF Awards.  This year, MEF announced the availability of a draft technical specification for SD-WAN service standardization. Through my SD-WAN market research, I have seen the SD-WAN ecosystem expand so rapidly over the past several years. On one hand, SD-WAN’s popularity is driving great innovation, but on the other hand, it is creating an overcrowded and confusing market place. It is good to see MEF getting behind SD-WAN service standardization, as this is the type of work needed to smooth out the challenges of deploying SD-WAN services and to accelerate the service adoption. There is a lot of work to be done on SD-WAN service standards, but we will be watching the progress with great interest.

Related links:

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On Tuesday, June 26, I presented a webinar introducing the 802.3bt™ Power over Ethernet (PoE), hosted by Dell’Oro Group and Ethernet Alliance.  Chad Jones with Cisco and David Tremblay with HPE were my partner speakers at this webinar.

PoE has already become the go-to for devices requiring low-voltage power. Coupled with emerging Internet of Things (IoT) devices like security cameras, medical devices, LED lighting, and more, the PoE application space is booming. With the ratification of IEEE 802.3.bt™ getting closer, the “Introducing IEEE 802.3bt™ Power over Ethernet” Webinar offers clarity on what to expect from this innovative technology.

To recap this webinar, we talked about:

  • What is Power Over Ethernet?
  • What are the different classes and types and how they all work together?
  • What are the different applications and devices driving PoE requirement?
  • How big is the PoE market opportunity from a device perspective?
  • How big is the PoE market opportunity from a switching perspective?
  • How many PoE switch ports do we expect over the next five years?
  • What are the new PoE requirements of new devices and how are the PoE requirements of traditional devices changing?
  • What are the new features and the new power levels of IEEE 802.3bt™?
  • Importance of interoperability testing and certification

Need a refresher?  Missed the webinar?  Click this link to watch the webinar recording.

I hope you can find this webinar valuable to you and get a lot out of it.

Enjoy!